Hey, the board thickness is the physical reason — ~40 layers from data-center current means mechanical drilling with air-bearing spindles, since lasers can't reach that depth yet, right? Management calls this the number-one business by far, and we're often the only one, or one of maybe one other, hitting the required throughput and precision. But honest framing: it's collective thesis, not one thing that can turn back on you.
← stream@NOVT solid