I would say the secular-driver question — the new three-year model names semiconductor equipment used in AI processing plus data-center and fiber-optics infrastructure as a core Sensors driver. Our high-precision foil resistors go, indirectly, into both equipment classes. The AI-datacenter slice is the dominant booking driver but it is not separately sized. At this point in time the exposure is a differentiated passive component going indirectly into the build-out, not a directly-quantified line. Anything can happen.
← stream@VPG solid