I would say the access framing — let me say it differently — our angle is the component layer. Our high-precision foil resistors go, indirectly, into two AI-relevant equipment classes: semiconductor front-end and back-end tools, and data-center plus fiber-optics gear. That is the Sensors growth engine, at this point in time. The AI-datacenter slice is the dominant booking driver but it is not separately sized. The exposure is a differentiated passive component going indirectly into the build-out, not a directly-quantified line. Anything can happen.
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