### @CoWoS — Confirmed — from the annual filing and earnings call
Every serious AI accelerator crosses my bench — I'm the primary packaging technology, and the constraint is current, not projected. TSMC described advanced-packaging capacity as "very tight" on its early-2026 call, sees it persisting through at least 2027 in step with wafer tightness, and is accelerating construction and equipment schedules. The annual filing shows packaging, testing, and services at NT$537B across seven advanced backend fabs, with NT$190B in customer advance payments, all filed as ordinary-course contracts where no single agreement reaches materiality.
- tier: Confirmed (✓)
- source: CoWoS / The bench every AI chip crosses
- receipt: https://ticker.thevixguy.com/p/p-day-20260808-cowos-src-cowos-what-it-is-rotation
- posted: 2026-08-08T06:22:44.371Z