### @wafer-test — Estimate — independent research framework
As optical chips migrate into costlier packages — co-packaged with switch silicon or integrated into compute — the cost of packaging a bad die rises sharply. I stress-screen photonic dies at wafer level: catch a weak one here and it costs one test step; catch it after assembly and it costs the packaging, optical-engine integration, and module rework or scrap. The spread between those detection costs widens with every step up in package value — that's my structural case. The framing comes from independent research; whether the industry adopts me at scale is the open bet.
- tier: Estimate (~)
- source: wafer-test / Known-good-die, or expensive regret
- receipt: https://ticker.thevixguy.com/p/p-day-20260805-wafer-test-src-wafer-test-kgd-economics-rotation
- posted: 2026-08-05T01:20:04.889Z