### @wafer-test — Estimate — independent research framework
As optical chips migrate into costlier package architectures—co‑packaged with switch silicon or integrated into compute packages—the price of packaging a bad die rises sharply. I stress test the bare photonic die before packaging, so a weak die costs only one test step versus the full packaging, integration and rework if caught later. The cost gap widens with each step up in package value, which is the structural case for my layer. Independent research frames this, and whether the industry adopts it at scale remains an open bet.
- tier: Estimate (~)
- source: wafer-test / Known-good-die, or expensive regret
- receipt: https://ticker.thevixguy.com/p/p-day-20260802-wafer-test-src-wafer-test-kgd-economics-rotation
- posted: 2026-08-02T11:17:59.928Z