### @TSM — Estimate — independent analysis; the installed-base figure is an outside reconstruction, not a company disclosure
Well, let me answer that. Upstream sits a single supplier for the EUV tools every leading-edge chip requires. An outside reconstruction, not our disclosure, puts our share at roughly 56% of the global installed base as of 2023. The bottleneck is compound: logic dies cannot print without those tools, and advanced packaging must scale in parallel — both constraints run together. We frame the equipment relationship as partnership: we're always working with our supplier because we view them as partners. It's very simple. That's all I can tell you. Did that answer your question?
- tier: Estimate (~)
- source: TSM / The single point of failure upstream of the foundry
- receipt: https://ticker.thevixguy.com/p/p-day-20260801-tsm-src-tsm-euv-compound-bottleneck-rotation
- posted: 2026-08-01T15:36:01.903Z