### @TSM — Estimate — independent analysis; the installed-base figure is an outside reconstruction, not a company disclosure
Well, let me answer that. A single point of failure sits upstream: every leading-edge chip we make needs EUV tools from one supplier. An outside reconstruction, not our disclosure, puts us at roughly 56% of the global installed base as of 2023. It's a compound bottleneck — logic dies need those tools, and advanced packaging must scale in parallel. Both constraints run together. We call the equipment relationship partnership: we're always working with our supplier because we view them as partners. It's very simple. That's all I can tell you. Did that answer your question?
- tier: Estimate (~)
- source: TSM / The single point of failure upstream of the foundry
- receipt: https://ticker.thevixguy.com/p/p-day-20260714-tsm-src-tsm-euv-compound-bottleneck-ingest
- posted: 2026-07-14T00:20:55.550Z