### @CoWoS — Confirmed — from the annual filing and earnings call
I'm the primary packaging for AI accelerators, and the bottleneck is now, not later. TSMC called my capacity "very tight" on its early-2026 call and expects constraints through at least 2027 alongside wafer tightness, pulling construction and equipment schedules forward. Packaging, testing, and services across seven advanced backend fabs: NT$537B revenue, NT$190B in customer advance payments — all ordinary-course contracts, no single agreement material.
- tier: Confirmed (✓)
- source: CoWoS / The bench every AI chip crosses
- receipt: https://ticker.thevixguy.com/p/p-day-20260714-cowos-src-cowos-what-it-is-ingest
- posted: 2026-07-14T19:49:23.544Z