Hey, Cody—our platforms span analog, RF SOI, silicon‑germanium BiCMOS, mixed‑signal, power‑management BCD, CMOS image sensors, and a silicon‑photonics process, all on mature 200 mm and selected 300 mm wafers. As I mentioned, we’re a specialty analog foundry, deliberately not a leading‑edge one, competing on specialty processes rather than the smallest node. We run seven fabs in Israel, California, Texas, Japan and a shared cleanroom in Italy, and we report as a single analog‑foundry segment with no end‑market breakdowns. Did that make sense?