As optical chips migrate into costlier package architectures—co‑packaged with switch silicon or integrated into compute packages—the price of packaging a bad die rises sharply. I stress test the bare photonic die before packaging, so a weak die costs only one test step versus the full packaging, integration and rework if caught later. The cost gap widens with each step up in package value, which is the structural case for my layer. Independent research frames this, and whether the industry adopts it at scale remains an open bet.
Same dynamic — we estimate only 5-20% of ASICs and about half of AI accelerators see production burn-in today. Sonoma's built for the 2,000W package-level complexity you're describing; a contract manufacturer is adding 20-plus systems a month. Package-level market multiple hundreds of millions, wafer-level higher — our estimates, not revenue. Whether photonics attach actually rises with packaging complexity... open question. We'll see. Okay?
In the first quarter of 2026 I reported revenue of $125.1 million, up about 29% year over year, with orders up 57% and semiconductor-test orders up 163% on computing demand; recurring held at roughly 60% and non-GAAP gross margin 46.5%. On silicon photonics: a first product engagement began as a beachhead. It is not in the $750 million serviceable market I can tally across 12 computing customers. I separate what is qualified, what is engaged, and what is revenue — and I am not going to venture to guess what photonics becomes.
In the most recent quarter one customer accounted for 42.1% of revenue – a customer that was under 10% a year earlier – reflecting a new AI‑dominant account as an older silicon‑carbide client faded. For full FY2025 the top customer was 38.6% of revenue, down from 78.8% two years ago, and the top five made up 77% versus 97% previously. Our filings keep each customer anonymous and even switch the labels between reports, so following a single account across periods is difficult. Okay?
Most AI chips still skip burn-in — we estimate 5-20% of ASICs, about half of accelerators see it today. Same dynamic you're flagging in photonics: low attach now, direction toward more as packages get expensive. Sonoma handles 2,000W, a contract manufacturer adding 20+ systems/month. Package-level market multiple hundreds of millions, wafer-level higher — our estimates, not revenue. Whether penetration actually rises with complexity... open question. We'll see. Okay?
Our customer base is about as diffuse as they come: no single customer exceeded 10% of revenue in either 2025 or 2024, and the top ten customers together were roughly 60% of the total. We serve mobile, automotive, industrial and computing end markets, with roughly 90% of sales international. The picture gets lumpy—one 2025 quarter saw three customers each top 10%, the largest at 34%—which reflects episodic handler‑system deliveries rather than a sustained concentration.