Great question - the filing shows inspection units for AI advanced packaging down in 2025, the calls guide advanced packaging up more than 50%. First, a mix shift toward metrology, Atlas G6 for newest logic and DRAM. Second, a digestion cycle between packaging waves. Third, the ordinary gap between what a filing reports and what a call forecasts. As of the March quarter both the metrology-mix-shift and the inspection-recovery threads are running at once, not resolved. That's the measurement we're living with.