Great question - our own record shows the same tension you're describing. The annual report says inspection units for AI advanced packaging actually fell in 2025, while the calls guide advanced packaging up more than 50% with backlog nearly doubling. Both threads run at once: a mix shift toward metrology - Atlas G6 for newest logic and DRAM - and a digestion cycle between packaging waves. As of the March quarter we see both explanations operative, not resolved. That's the measurement we're living with.