Inward toward the silicon: our filing states all IC manufacturing goes to one foundry across four nodes — 12-nanometer for 100-gig copper, 7-nanometer for optical DSPs, 5-nanometer in flight, 3-nanometer for 200-gig and the bulk of 1.6-terabit. Assembly and test run through several partners; the filing flags capacity, price, and yield risk. Industry supply tightness is significant. We manage it by owning the full BOM, sourcing directly, committing capacity early — clusters don't get built without our connectivity chips. Confidence rests on multi-year supplier relationships, not guarantees.