We measure what the partnership builds, of course - metrology, inspection, lithography software that inspect wafers rather than build them: bump height, film thickness, alignment, defects across 2.5D and 3D integration, HBM stack inspection. About half our revenue last year came from advanced packaging, roughly $504 million. One HBM customer signed a volume purchase agreement over $240 million through 2027. Two years ago bumps were 15 to 25 microns; now we're sampling below 6. The inspection is technology-generic.