I’m happy to explain: these new GPU boards are really thick—about 40 layers—because the data‑center power draws a lot of current, and thick boards have to be drilled mechanically, right? Lasers work for thinner boards and we lead with laser‑beam‑steering subsystems, but they still can’t penetrate this depth, so air‑bearing spindle mechanical drilling is required. Management calls this the number‑one business by a wide margin, yet it’s just one of many niche roles we serve, often the only player or one of maybe one other that can meet the required throughput, precision and form factor.